|
Family(逻辑族) |
中英文大意 |
Prefix(前缀) |
|
ANA |
|
U |
|
BGA |
Ball Grid Array（球栅阵列封装） |
U |
|
BPF |
|
U |
|
BQF |
|
U |
|
CAP |
CAPACITOR（电容器） |
C |
|
CFP |
CFP（陶瓷扁平封装） |
U |
|
CLC |
|
U |
|
CMO |
|
U |
|
CON |
CONIN（连接器）CON接口 |
J |
|
CQF |
|
U |
|
DIO |
DIODE(二极管） |
D |
|
DIP |
Dual In-line Package（双列直插式组件） |
U |
|
ECL |
|
U |
|
EDG |
|
P |
|
FUS |
FUSE（保险丝） |
F |
|
HMO |
|
U |
|
HOL |
|
X |
|
IND |
INDUCTANCE（电感） |
L |
|
LCC |
Leadless chip carrier（无引脚片式载体） |
U |
|
MOS |
Metal Oxide Semiconductor（金属氧化物半导体） |
U |
|
OSC |
Open Source Commerce（振荡器） |
Y |
|
PFP |
|
U |
|
PGA |
butt joint pin grid array碰焊 (pin grid array) |
U |
|
PLC |
|
U |
|
POT |
POTENTIOMETER（可变电阻器） |
P |
|
PQF |
|
U |
|
PSO |
|
U |
|
QFJ |
CLCC(ceramic leaded chip carrier)也称QFJ,QFJ-G |
U |
|
QFP |
Quad flat package(四侧引脚扁平封装) |
U |
|
QSO |
|
U |
|
RES |
Resistor（电阻器） |
R |
|
RLY |
RLY（继电器） |
K |
|
SCR |
Silicon Controlled Rectifier（可控硅） |
SC |
|
SKT |
|
U |
|
SOI |
small out-line I-leaded package(I形引脚小外型封装) |
U |
|
SOJ |
Small Out-Line J-Leaded Package(J形引脚小外型封装) |
U |
|
SOP |
Small Out-Line package(小外形封装) |
U |
|
SSO |
|
U |
|
SWI |
SWITCH（开关） |
S |
|
TQF |
|
U |
|
TRX |
Transistor(三极管） |
Q |
|
TSO |
|
U |
|
TTL |
Transistor-Transistor Logic(BJT-BJT逻辑门） |
U |
|
VSO |
|
U |
|
XFR |
XFMR（变压器） |
T |
|
ZEN |
ZENER（齐纳二极管） |
Z |
|
UND |
|
|
|
SIP |
Single in-line package（直插式组件） |
U |
|
|
Photoelectric coupler(光电耦合器） |
U/N |
|
LED |
Light Emitting Diode（发光二极管） |
LED |
|
TVS |
Transient Voltage Suppressor(瞬态电压抑制二极管) |
TVS |
|
FB |
Ferrite bead(磁珠) |
FB |
|
TP |
TEST POINT(测试点） |
TP |
|
MIC |
MICROPHONE (麦克风) |
MIC |
|
BQFP |
BQFP(quad flat package with bumper)带缓冲垫的四侧引脚扁平封装 |
U |
|
CLCC |
Ceramic leaded chip carrier(带引脚的陶瓷芯片载体) |
U |
|
COB |
Chip on board(板上芯片封装) |
U |
|
DFP |
Dual flat package(双侧引脚扁平封装)(是SOP 的别称) |
U |
|
FP |
Flat package(扁平封装) |
U |
|
FQFP |
Fine pitch quad flat package(小引脚中心距QFP) |
U |
|
CQFP |
Quad fiat package with guard ring(带保护环的四侧引脚扁平封装 |
U |
|
HSOP |
H-(with heat sink)HSOP 表示带散热SOP |
U |
|
LQFP |
Low profile quad flat package(薄型QFP) |
U |
|
SMD |
Surface mount devices(表面贴装器件) |
U |
|
CPGA |
Ceramic Pin Grid Array |
U |
|
ZIP |
Zig-Zag Inline Package （之字型直插式封装） |
U |
|
TSOP |
Thin Small Outline Package |
U |
|
TSSOP |
TSOP II Thin Shrink Outline Package |
U |
来源：CSDN
作者：GhostGuardian
链接：https://blog.csdn.net/GhostGuardian/article/details/104174872